EL is an “X-ray” for modules
Infrared shows heat, IV shows electrical curves — both are indirect. EL directly reveals internal structural defects. Understand the differences to choose the right method.
How daytime EL works
Traditional EL must wait for darkness, constrained by schedule, weather and safety. The GK-8000 uses short-wave infrared (InGaAs) imaging with lock-in differential algorithms to capture readable EL images in daylight (0–1200 W/m²) — moving a night-only task into the day, with a longer working window, higher efficiency and lower night high-altitude risk.
What is operating-condition EL
Conventional offline night EL requires shutting down modules and applying external bias. Operating-condition EL images modules while they are energized and generating power — no shutdown, no output impact — reflecting the true operating state, something offline night EL cannot do.
Why EL is a “complement”, not a replacement
When power data and infrared thermal results conflict, you often need a method that directly sees the internal structure to settle it:
- Infrared thermal tells you “where it is hot”, but whether it is a crack, cold solder or shading needs further judgment;
- IV curves tell you “overall electrical performance”, but not which module or location is at fault;
- EL imaging directly shows internal cracks and broken gridlines — like an X-ray — settling disputes and forming a closed-loop diagnosis.
Used together, the three provide more complete and credible diagnosis.
Aligned with international standards
EL image acquisition, image-quality evaluation and defect interpretation follow IEC TS 60904-13:2018; operating-condition EL is a field method Longsafe developed for in-service modules, and its specific test conditions differ from conventional forward-bias EL. On-site work references IEA-PVPS Task 13 environmental and safety guidance, with report structure mapping to the standard clauses for archiving and grid-connection evidence.
Three methods, three dimensions
Not replacements — EL is a strong complement to thermal / IV, and combined use gives more complete diagnosis.
EL (electroluminescence)
Energize the module and image it to directly “see” hidden cracks, micro-cracks, broken gridlines and cold solder — pixel-level internal defects.
Infrared thermal
Shows heat anomalies and locates hotspots, but cannot directly explain the internal structural cause.
IV curve
Shows electrical performance and overall output — an indirect inference that cannot pinpoint the defect location.
Not sure which method to use?
Tell us your diagnostic goal and we will recommend the best combination.